Thermal management plates and package baseplates for custom projects.
Component types
- Thermal-management baseplates
- Power-module package substrates
- Inverter heat-dissipation plates
- RF module packaging and microwave housings
Details for your drawing
Specify the AlSiC composition, required thermal properties, mating-face flatness and any metal inserts.
Material selection
AlSiC combines thermal conductivity, low adjustable thermal expansion and stiffness. The SiC fraction and processing affect the resulting properties.
Before requesting a quote
Share the drawing revision, material grade and condition, quantity, critical dimensions, surface finish and inspection requirements.
